Icepak in Ansys Electronics Desktop — Getting Started

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Thermal analysis at the components and system levels is required to foresee device performance over long durations. Using thermal analysis can help you evaluate the internal heat generated by the electronic circuits and visualize the possible ventilation by following the airflow. Thus, designers can ensure that these electronic circuits or devices operate in desired thermal conditions. Thermal analysis can also determine the effects of environmental conditions on these electronic circuits. The Icepak tool integrated with the Ansys Electronics Desktop (AEDT) can be used for this electrothermal analysis. This course focuses mainly on the basics of Icepak and electrothermal analysis by using multiphysics analysis inside AEDT.

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Maxwell is an electromagnetic tool for analyzing low-frequency phenomena and devices. It is integrated into the Electronics Desktop, together with all the other Ansys electromagnetic tools. It can also be integrated in the Workbench Platform for multiphysics analysis. Geometries can be created either directly inside Maxwell or imported from external CAD tools. Maxwell can be launched from an Ansys Workbench installation as well. This workflow is intended for when Maxwell will be using any of the variety of features in the Workbench system, such as CAD connections, design of experiments or multiphysics analysis. Quasi-static solvers in Maxwell offer an automatic meshing refinement algorithm. The transient solver allows the analysis of large movements and mechanical transients.

In this course, you will learn the basics of Ansys HFSS geometry design and the EM simulation workflow. This course will cover concepts like creating a geometry, assigning boundaries, analyzing the solution setup and plotting the results with field overlays.

Ansys Electronics Desktop (AEDT) provides a common user interface for multiple products, where each product focuses on a specific kind of physics. Ansys HFSS offers two different approaches: (1) HFSS fully arbitrary 3D (FA3D), which is also known as MCAD, and (2) HFSS 3D layout. HFSS 3D layout can be extensively used for simulations with layers, nets, components and padstacks. It also contains multiple solver types. HFSS 3D layout structures geometry in terms of layers that are common in electronic computer-aided design (ECAD), including printed circuit board (PCB) layout and RF/microwave circuits. The 3D meshing and FEM simulation in HFSS 3D layout are the same as in HFSS fully arbitrary 3D geometry (MCAD) simulation. This course focuses mainly on the basics of HFSS 3D layout and emphasizes its key features and capabilities.