Thermal analysis at the components and system levels is required to foresee device performance over long durations. Using thermal analysis can help you evaluate the internal heat generated by the electronic circuits and visualize the possible ventilation by following the airflow. Thus, designers can ensure that these electronic circuits or devices operate in desired thermal conditions. Thermal analysis can also determine the effects of environmental conditions on these electronic circuits. The Icepak tool integrated with the Ansys Electronics Desktop (AEDT) can be used for this electrothermal analysis. This course focuses mainly on the basics of Icepak and electrothermal analysis by using multiphysics analysis inside AEDT.