Electronics Engineering Courses

Multipaction is an electron resonance effect that occurs when applied RF fields accelerate electrons that are in a vacuum and cause them to impact with a surface, which depending on its energy, release one or more electrons into the vacuum - an avalanche effect like in lasers. Multipaction only occurs in a vacuum. In this AIC Module, you will be introduced to the Multipaction feature using HFSS in AEDT 2020 R2 that will help you to design and analyze for a wide number of cutting-edge applications. A coaxial geometry is used as a course model to demonstrate this feature.

In this module, we describe cosimulation as a method of design. By definition, the method of cosimulation involves two or more simulation types that are performed to simulate a whole system. With cosimulation, a dynamic link is created between the two tools so that the changes in one tool is reflected in the other in real time. The power of cosimulation will be demonstrated with the help of a 5G phased array application. We will focus on the cosimulation abilities of the Ansys HFSS MCAD, HFSS ECAD and Circuit tools present in the Ansys Electronic Desktop. However, the cosimulation feature can also be used across different Ansys physics tools.

Maxwell is an electromagnetic tool for analyzing low-frequency phenomena and devices. It is integrated into the Electronics Desktop, together with all the other Ansys electromagnetic tools. It can also be integrated in the Workbench Platform for multiphysics analysis. Geometries can be created either directly inside Maxwell or imported from external CAD tools. Maxwell can be launched from an Ansys Workbench installation as well. This workflow is intended for when Maxwell will be using any of the variety of features in the Workbench system, such as CAD connections, design of experiments or multiphysics analysis. Quasi-static solvers in Maxwell offer an automatic meshing refinement algorithm. The transient solver allows the analysis of large movements and mechanical transients.

In this course, you will learn the basics of Ansys HFSS geometry design and the EM simulation workflow. This course will cover concepts like creating a geometry, assigning boundaries, analyzing the solution setup and plotting the results with field overlays.

Thermal analysis at the components and system levels is required to foresee device performance over long durations. Using thermal analysis can help you evaluate the internal heat generated by the electronic circuits and visualize the possible ventilation by following the airflow. Thus, designers can ensure that these electronic circuits or devices operate in desired thermal conditions. Thermal analysis can also determine the effects of environmental conditions on these electronic circuits. The Icepak tool integrated with the Ansys Electronics Desktop (AEDT) can be used for this electrothermal analysis. This course focuses mainly on the basics of Icepak and electrothermal analysis by using multiphysics analysis inside AEDT.

In this course, you will learn the basics of Ansys Q3D Signal Integrity and Quasi-static EM field simulation workflow. This course will also cover some basic equations related to capacitance and inductance and then introduce few basic matrix operations. It introduces two important capacitance matrices – Maxwell and SPICE capacitance matrices.

Ansys Electronics Desktop (AEDT) provides a common user interface for multiple products, where each product focuses on a specific kind of physics. Ansys HFSS offers two different approaches: (1) HFSS fully arbitrary 3D (FA3D), which is also known as MCAD, and (2) HFSS 3D layout. HFSS 3D layout can be extensively used for simulations with layers, nets, components and padstacks. It also contains multiple solver types. HFSS 3D layout structures geometry in terms of layers that are common in electronic computer-aided design (ECAD), including printed circuit board (PCB) layout and RF/microwave circuits. The 3D meshing and FEM simulation in HFSS 3D layout are the same as in HFSS fully arbitrary 3D geometry (MCAD) simulation. This course focuses mainly on the basics of HFSS 3D layout and emphasizes its key features and capabilities.

Ports are the interfaces of the system through which electromagnetic fields propagate into or away from the system. These ports can be used either as sources or as sinks depending on the requirements of the user. HFSS has various options to generate incident fields that interact with a structure to produce the total fields on the computational need. Some of these excitations offered by HFSS are wave port, lumped port, Floquet port. This course explains briefly about these port types and serves as a guide for selecting the appropriate port types for the user needs.

The Floquet port is one of the excitation types offered by HFSS for the electromagnetic simulations. This kind of port is used exclusively with planar-periodic structures. Some of the examples are planar phased arrays and frequency selective surfaces when these may be idealized as infinitely large. The planar phased arrays are extensively used in 5G, ADAS, V2X applications. In this course we will introduce the Floquet port and its key features followed by analysis of an example.

Antennas are the means of communication that can transmit as well as receive signals. The communication distance depends not only on the operating frequency band but also on the design characteristics of the radiating element. Out of all the available antenna types, patch antennas can be compact and of low profile while having required radiation capabilities. However, certain applications like 5G, ADAS, V2X require these patch antennas implemented in array for having more directional gain, impedance bandwidth, beam steering capability, etc. In this AIC module, we are going to detail microstrip patch and its array as a method of design.

Ansys Electronics Desktop or simply AEDT provides a comprehensive environment for the design and analysis of electronic components. AEDT offers multiple design types that are required to do a full system analysis. Ansys HFSS is one of the design types integrated in AEDT which is a high-frequency simulation software used for the design and analysis of high-frequency electromagnetic components. HFSS offers various types of solvers to suit for various applications. It provides wide variety of reports ranging from 2D rectangular plots to 3D field plots inside the complex geometries which will help in understanding the electromagnetic concepts. Ansys HFSS can be used to design simple as well as complex simulation models and hence it is required to know how to use the tool for an efficient analysis. This course provides step by step procedure required for analysis using AEDT student version. The steps and procedure shown in this course are not limited to student version alone but can also be used for commercial version. More details about this student version are found here. In this course, we will demonstrate the analysis of different types of waveguides such as simple waveguide, stacked waveguide, twist and bent waveguides using WR-15 standard waveguide as example.

Key design objectives for high-speed digital systems is signal integrity and power integrity. Problems associated with signal and power integrity can be diagnosed and addressed in Ansys SIwave. SIwave is used for signal integrity, crosstalk, power integrity, and electromagnetic interference (EMI) analysis of chips, packages, and boards. To transfer large amounts of data within and across server systems at high speeds, many engineering challenges need to be solved. For instance, high-speed digital channels need to be optimized for server boards to transfer signals with low latency. A signal integrity simulation of a server system can assess these problems and provide significant insights into the channel’s performance. In this video, we’ll learn how to configure one such communication channel on a server motherboard and run a signal integrity simulation in Ansys SIwave.

This course covers the steps of multi-material toroidal inductor design for power converters. Magnetic components are used to store and convert electric and magnetic energy and hence they are widely used in switching power converters. One challenge associated with them is their bigger size due to which it is difficult to design smaller power devices. To reduce the size while maintaining the inductance of the magnetic component, multi material inductor design is proposed in which more than one material is used as a core of the inductor. You will learn how to set up the parametric analysis in Ansys Maxwell to get best suited dimensions for the power converter.

Ansys Maxwell is an electromagnetic simulation tool that is integrated into the Ansys Electronics Desktop (AEDT). Maxwell is used for analyzing low-frequency electronic devices and machines or when simulating with materials that have a nonlinear BH curve or material anisotropy.
We will create and analyze both a 3D and 2D model of an electromagnetic fail-safe brake system using a DC magnetostatic solver in Maxwell. All the necessary steps required to perform a Maxwell simulation are discussed.

 

Every electronic device or circuit generates heat during its operation. The level of heat thus generated may vary depending on operating power, components density, type of components, etc. present in that device. Heat can degrade the performance of any electronic circuit if it is above the threshold level. Even a small amount of heat over the long run can also have negative effects. For any designer, it is crucial to see if the amount of heat generated is within the operable limits of the device or not. Hence thermal analysis of any electronic device is very important as it can identify the heat sources and the amount of heat generated at various operating points.
This course is designed to demonstrate the workflow for Electro-Thermal Management (ETM) using HFSS and Icepak inside the student version of Ansys Electronics Desktop.

 

 

In this course, the Ansys Maxwell Eddy Current solver and electrothermal two-way coupling between Ansys Maxwell and Ansys Icepak will be discussed.
This course starts with the simulation of an electromagnetic brake (EMB) using the Maxwell Eddy Current solver. It also covers the simulation workflow required to perform electrothermal analysis using Maxwell and Icepak inside Ansys Electronics Desktop (AEDT) Student version. Finally, we will see the temperature rise in parts of the EMB by changing the source parameters.