In today’s era where the world is heading towards the IoT and 5G+ technologies, the realization of highly efficient, compact size and lower cost microwave passive components has become highly crucial. A passive component does not require external power for its operation. Currently engineers are asked to design these components to meet future needs such as bandwidth enhancement, latency reduction and data rate increment. These extended needs pose new design challenges and manufacturing constraints.
The performance of a microwave passive component depends on impedance characteristics of the device and for planar board configurations that means the dimensions of the trace and the dielectric properties of the substrate. In this course, we will study the output effects due to variations in material properties and trace dimensions using the parametric and optimization features in Ansys Electronics Desktop (AEDT).
We will discuss and show how simulation will help to tackle these new performance and design challenges. We will explore some interesting features of AEDT such as optimization, parametrization, 3D components and the wrap function while designing various microwave passive components.
There are many applications where microwave components function as couplers, filters, power dividers, attenuators, terminators, etc. In this course, we will simulate the following microwave passive components from one of the standard microwave textbooks using HFSS, HFSS Circuit and HFSS 3D Layout design types which are part of the AEDT platform.
- Branchline Coupler
- T Junction Power Divider
- Wilkinson Power Divider
- Microstrip Filter
- Single Section Coupler