Electrothermal Management (ETM) using Ansys HFSS and Icepak

Current Status
Not Enrolled
Price
Free
Get Started

Every electronic device or circuit generates heat during its operation. The level of heat generated may vary depending on many factors, including but not limited to operating power, component density, or component type. Heat can degrade the performance of any electronic circuit if it is above the local threshold temperature level. Even a small amount of heat over the long run can have negative effects. For any designer, it is crucial to see if the amount of heat generated is within the operating limits of the device. Thermal analysis of any electronic device is very important, as it can identify heat sources and the amount of heat generated at various operating points. This allows the designer to ensure that the required level of cooling counters heat generated during use and keeps the temperature within operating limits. This improves the accuracy of predicting the device’s response over temperature.

Heat can also be generated due to electromagnetic (EM) losses. This course is designed to demonstrate the workflow for electrothermal management (ETM) using HFSS and Icepak inside the student version of Ansys Electronics Desktop.

To download Ansys Electronics Desktop Student version for free, click here.

Recommended Courses

Electronics
Learn Simulation

Multi-material Inductor

In this module, we describe cosimulation as a method of design. By definition, the method of cosimulation involves two or more simulation types that are performed to simulate a whole system. With cosimulation, a dynamic link is created between the two tools so that the changes in one tool is reflected in the other in real time. The power of cosimulation will be demonstrated with the help of a 5G phased array application. We will focus on the cosimulation abilities of the Ansys HFSS MCAD, HFSS ECAD and Circuit tools present in the Ansys Electronic Desktop. However, the cosimulation feature can also be used across different Ansys physics tools.

Antennas are the means of communication that can transmit as well as receive signals. The communication distance depends not only on the operating frequency band but also on the design characteristics of the radiating element. Out of all the available antenna types, patch antennas can be compact and of low profile while having required radiation capabilities. However, certain applications like 5G, ADAS, V2X require these patch antennas implemented in array for having more directional gain, impedance bandwidth, beam steering capability, etc. In this AIC module, we are going to detail microstrip patch and its array as a method of design.