3D Convection through an Electronics Box

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Cooling electronics components is important for smooth, reliable operation. The thermal power generated by the electronics is detrimental to their operation and often leads to premature failure and a shortened lifecycle. The thermal energy generated by these semiconductor devices must be transported away from the electronics to maintain the temperature of the electronics below a specified critical value for reliable operation. Any temperature higher than the critical temperature can damage the electronics.  This is true for laptops, desktops and even smartphones. In most cases, engineers designing these thermal solutions rely on convective heat transfer for transporting the thermal power away from the electronics. These thermal solutions often involve blowing relatively cooler air over electronics. The thermal power from the electronics is convected by this cooler air, causing a rise in the fluid temperature. This SimCafe course was developed by Rajesh Bhaskaran, Swanson Director of Engineering Simulation at Cornell University in partnership with Ansys. It serves as an e-learning resource to integrate industry-standard simulation tools into courses and provides a resource for supplementary learning outside the classroom. In this tutorial, we will learn to model the convective heat transfer through an electronics box by following the end-to-end workflow in Ansys Workbench.
For more ways to learn, check out the Cornell edX course, A Hands-on Introduction to Engineering Simulations at ansys.com/cornell.
Cornell University also offers a Fluid Dynamics Simulations Using Ansys online certificate authored by Dr. Rajesh Bhaskaran. Learn more here: https://ecornell.cornell.edu/fluiddynamics

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